Printed circuit board with through-holes including a test land having two current measuring lands and two resistance measuring lands
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United States of America Patent
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-
Nov 30, 1993
Grant Date -
N/A
app pub date -
Apr 9, 1991
filing date -
Apr 16, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board having through-holes and a test land for testing the through-holes. The test land is composed of a pair of current measurement lands and a pair of resistance measurement lands in order to test accurately the packing conditions of the conductive paste packed in the through-holes, thereby improving the uniformity and completeness of conductive-paste packing in printed circuit boards.
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