Package for multiple removable integrated circuits
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United States of America Patent
Stats
-
Dec 7, 1993
Grant Date -
N/A
app pub date -
Sep 11, 1992
filing date -
Sep 11, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package has multiple integrated circuits (ICs) mounted face down directly on one surface of a flexible circuit which is disposed in an opening of a rigid signal carrier, such as a pin grid array. The flexible circuit provides connections among the ICs, and also between the ICs and the signal carrier via wirebonds. The flexible circuit is attached to a rigid support ring that is bonded to the signal carrier adjacent to the opening. A thermally conductive lid covers the opening and contacts the backs of the ICs for heat removal. A rigid plate presses elastomeric pads against the other surface of the flexible circuit to maintain firm contact between the flexible circuit and the ICs and also between the ICs and the lid. The package may be hermetically sealed by attaching a cover to the support ring.
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