Printed wiring board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5268535
SERIAL NO

07739707

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed wiring board has a substrate having an outer peripheral edge. A printed circuit is formed on at least one side of the substrate. A shock-absorbing band formed of copper foil is disposed along at least a portion of the outer peripheral edge of at least one side of the substrate and is effective to absorb at least some of the impact applied to the printed wiring board during cutting thereof.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
NIPPON CMK CORP A CORP OF JAPAN1106 FUJIKUBO MIYOSHI-CHO IRUMA-GUN SAITAMA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haruyama, Satoshi Saitama, JP 19 280
Kawakami, Shin Saitama, JP 33 461
Okonogi, Hirotaka Saitama, JP 29 390

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