Slitter machine for use in manufacturing semiconductor devices
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United States of America Patent
Stats
-
Dec 14, 1993
Grant Date -
N/A
app pub date -
Sep 23, 1991
filing date -
Sep 23, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A slitter machine for slitting a film sheet wound on a core in a roll to obtain desired widths of film sheet for laminating onto metallic substrates of semiconductor devices comprises a main frame, notches on the main frame for rotatably supporting the roll on the frame, a rotatable knife blade for slitting the roll sheet into a strip of desired width, a tiltable knife blade mounting plate on the frame for mounting the knife blade on the frame, guide tracks adjusting the lateral position of the knife blade to adjust the width of the strip being cut, an air cylinder for pressing the knife blade into the rolled sheet to cut the sheet into strips of the desired width, and a sensing roller for limiting the depth of the cut.
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