Soldering method
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United States of America Patent
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-
Dec 21, 1993
Issued Date -
N/A
app pub date -
Mar 16, 1992
filing date -
Jan 17, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a method of soldering electronic components to each other. When a member to be bonded is soldered to a base material by irradiating the member to be bonded with laser lights, the laser lights are incident upon a laser light transmittable probe and are emitted from the front end of the probe and the front end of the probe is in substantial contact with a solder or the member to be bonded.
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