Electrical interconnect device with interwoven power and ground lines and capacitive vias
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United States of America Patent
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Dec 21, 1993
Grant Date -
N/A
app pub date -
Sep 2, 1992
filing date -
Sep 2, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to an electrical interconnect device with power and ground lines interwoven about signal line layers and capacitive vias between signal layers so as to make efficient use of otherwise undedicated area between signal lines and signal layers and to reduce or eliminate the need for separate power and ground layers while providing decoupling capacitance within the wiring structure.
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