Lead conditioning apparatus and method for semiconductor devices
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United States of America Patent
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Dec 28, 1993
Grant Date -
N/A
app pub date -
Dec 11, 1991
filing date -
Dec 11, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for conditioning the leads of a semiconductor device having parallel leads projecting in a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus further includes a device for forming the leads to at least partially remove any bends in the leads, and a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, forming the leads to a partially unbent condition, and shaping the leads in a desired lead configuration.
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