Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5273938
SERIAL NO

07876315

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FREESCALE SEMICONDUCTOR, INC.AUSTIN, TX1003

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Paul T Austin, TX 44 5054
McShane, Michael B Austin, TX 58 4248

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

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Patent Info (Count) # Cites Year
 
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UTAC HONG KONG LIMITED (1)
* 6229200 Saw-singulated leadless plastic chip carrier 384 1998
 
MITSUI HIGH-TEC, INC. (2)
* 5527740 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities 43 1994
* 6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method 4 2001
* Cited By Examiner