Foamable epoxy resin composition
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United States of America Patent
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Dec 28, 1993
Grant Date -
N/A
app pub date -
Feb 18, 1992
filing date -
Feb 19, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a foamable epoxy resin composition (A) 100 parts by weight of a liquid epoxy resin (B) 0.5-20 parts by weight of a latent curing agent, (C) 0.5-15 parts by weight of a foaming agent having a decomposition temperature of 100.degree.-220.degree. C., (D) 0.05-5 parts by weight of a surface active agent and (E) 10-200 parts by weight of a rubbery elastomer or a powdery halogen-free thermoplastic resin of 150 .mu.m or less in average particle diameter, which composition has a melt viscosity of 2.5.times.10.sup.3 -5.times.10.sup.4 dPa.multidot.s at the decomposition temperature of said foaming agent. The composition can provide a foamed material of rigidity and good heat resistance, having an expansion ratio of 5 times or more and a dense cell structure of 0.5 mm or less in average cell diameter.
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