Method of manufacturing a printed wiring board
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United States of America Patent
Stats
-
Jan 4, 1994
Grant Date -
N/A
app pub date -
Jun 18, 1991
filing date -
Jun 22, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention has been achieved to solve the problem mentioned above. The object of the invention is to provide a novel method of manufacturing a printed wiring board by allowing manufacturers to provide a slit and perforations on the substrate without causing even the slightest crack to be generated in the course of manufacturing the printed wiring board. In the course of manufacturing printed wiring boards splittable across a slit and perforations,the method embodied by the invention executes those sequential steps including the following; provision of thickness adjusting film for specific regions adjacent to the slit and perforations; adjustment of the thickness of a main substrate and a splittable substrate which is splittable by means of the slit and the perforations; and formation of the slit and the perforations by applying a pressing and punching process.
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