Method of manufacturing printed wiring board
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United States of America Patent
Stats
-
Jan 11, 1994
Grant Date -
N/A
app pub date -
Oct 28, 1992
filing date -
Jan 30, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
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