Method for masking through holes in manufacturing process of printed circuit board
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United States of America Patent
Stats
-
Jan 11, 1994
Grant Date -
N/A
app pub date -
Oct 11, 1991
filing date -
Oct 15, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for masking through-holes during the manufacture of a printed circuit board comprises providing a substrate having a plurality of through-holes. A removable masking seal comprised of a soluble material, a light-setting material or a thermo-setting material is formed on the surface of the substrate to cover at least one of the through-holes. At least one of the through-holes that is not covered with the masking seal is filled with a filler material by a conventional silk screen process. The masking seal is then removed, either by dissolving the masking seal in the case of the soluble material, or in the case of the light-setting or thermo-setting material, the masking seal is set by applying light or heat to reduce adhesion between the masking seal and the substrate, and then the set masking seal is peeled off to expose the through-hole.
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