Semiconductor device and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 1994
Issued Date -
N/A
app pub date -
Jun 26, 1992
filing date -
Jun 28, 1989
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device includes a first frame having a bed, a semiconductor chip mounted on the bed and having a bonding pad, a second frame having an inner lead located above the semiconductor chip, a bonding wire connecting the bonding pad of the semiconductor chip to the tip end of the inner lead, and a shock-absorbing layer which is adhered at least to that surface portion of the tip end of the inner lead which faces the semiconductor chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully