Electronic packages and smart structures formed by thermal spray deposition
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United States of America Patent
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-
Jan 11, 1994
Grant Date -
N/A
app pub date -
Jul 15, 1991
filing date -
Jul 15, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A smart structure or an electronic package is formed by thermal spraying utilizing a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the structure. Masks are placed above a work surface and sprayed with either at least one primary material to form at least one electronic component and a complementary material. In this manner, layers of material form a block of deposition material and complementary material. Then, the complementary material which serves as a support structure during forming may be removed.
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