Importance

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Abstract

An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

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First Claim