US Patent No: 5,279,029

Number of patents in Portfolio can not be more than 2000

Ultra high density integrated circuit packages method

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Abstract

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An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STAKTEK GROUP L.P.AUSTIN, TX24

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burns, Carmen D Austin, TX 75 3994

Cited Art Landscape

Patent Info (Count) # Cites Year
 
AMOCO/ENRON SOLAR (1)
4,241,493 Method of fabricating solar cell modules 45 1978
 
MICRO CO., LTD. (1)
4,733,461 Method of stacking printed circuit boards 147 1986
 
Saint-Gobain Vitrage (1)
4,321,418 Process for manufacture of solar photocell panels and panels obtained thereby 54 1980

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (155)
6,455,356 Methods for moding a leadframe in plastic integrated circuit devices 39 1999
6,847,103 Semiconductor package with exposed die pad and body-locking leadframe 12 1999
6,476,478 Cavity semiconductor package with exposed leads and die pad 7 1999
6,448,633 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 157 1999
6,433,277 Plastic integrated circuit package and method and leadframe for making the package 27 2000
7,102,208 Leadframe and semiconductor package with improved solder joint strength 3 2000
6,521,987 Plastic integrated circuit device package and method for making the package 40 2000
6,858,919 Semiconductor package 69 2001
6,759,737 Semiconductor package including stacked chips with aligned input/output pads 37 2001
6,756,658 Making two lead surface mounting high power microleadframe semiconductor packages 20 2001
7,042,068 Leadframe and semiconductor package made using the leadframe 10 2001
6,611,047 Semiconductor package with singulation crease 19 2001
6,605,865 Semiconductor package with optimized leadframe bonding strength 7 2001
6,684,496 Method of making an integrated circuit package 11 2001
6,713,322 Lead frame for semiconductor package 36 2001
6,803,645 Semiconductor package including flip chip 1 2001
6,927,478 Reduced size semiconductor package with stacked dies 70 2002
6,798,046 Semiconductor package including ring structure connected to leads with vertically downset inner ends 10 2002
6,885,086 Reduced copper lead frame for saw-singulated chip package 9 2002
6,700,187 Semiconductor package and method for manufacturing the same 17 2002
6,608,366 Lead frame with plated end leads 25 2002
6,627,977 Semiconductor package including isolated ring structure 36 2002
6,825,062 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 11 2002
6,630,728 Plastic integrated circuit package and leadframe for making the package 20 2002
6,841,414 Saw and etch singulation method for a chip package 30 2002
6,867,071 Leadframe including corner leads and semiconductor package using same 10 2002
6,818,973 Exposed lead QFP package fabricated through the use of a partial saw process 86 2002
6,919,620 Compact flash memory card with clamshell leadframe 1 2002
6,798,047 Pre-molded leadframe 7 2002
6,777,789 Mounting for a package containing a chip 9 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 16 2003
6,927,483 Semiconductor package exhibiting efficient lead placement 31 2003
6,794,740 Leadframe package for semiconductor devices 7 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 6 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 98 2003
7,008,825 Leadframe strip having enhanced testability 34 2003
6,876,068 Semiconductor package with increased number of input and output pins 53 2003
6,897,550 Fully-molded leadframe stand-off feature 3 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,041 Power semiconductor package with strap 18 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 1 2003
7,245,007 Exposed lead interposer leadframe package 52 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 8 2003
6,846,704 Semiconductor package and method for manufacturing the same 12 2003
6,967,395 Mounting for a package containing a chip 15 2003
6,893,900 Method of making an integrated circuit package 2 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,144,517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 6 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 10 2003
7,115,445 Semiconductor package having reduced thickness 1 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 3 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 8 2004
7,170,150 Lead frame for semiconductor package 3 2004
6,844,615 Leadframe package for semiconductor devices 12 2004
7,005,326 Method of making an integrated circuit package 6 2004
7,190,062 Embedded leadframe semiconductor package 30 2004
7,067,908 Semiconductor package having improved adhesiveness and ground bonding 4 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 52 2004
7,598,598 Offset etched corner leads for semiconductor package 1 2004
7,202,554 Semiconductor package and its manufacturing method 17 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 19 2004
7,217,991 Fan-in leadframe semiconductor package 11 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 50 2004
7,001,799 Method of making a leadframe for semiconductor devices 4 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 3 2004
7,176,062 Lead-frame method and assembly for interconnecting circuits within a circuit module 0 2005
7,214,326 Increased capacity leadframe and semiconductor package using the same 5 2005
7,247,523 Two-sided wafer escape package 20 2005
6,995,459 Semiconductor package with increased number of input and output pins 63 2005
7,192,807 Wafer level package and fabrication method 22 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2005
7,507,603 Etch singulated semiconductor package 10 2005
7,361,533 Stacked embedded leadframe 28 2005
7,572,681 Embedded electronic component package 30 2005
7,112,474 Method of making an integrated circuit package 1 2005
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 1 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 1 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 37 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 3 2006
7,321,162 Semiconductor package having reduced thickness 1 2006
7,332,375 Method of making an integrated circuit package 1 2006
7,521,294 Lead frame for semiconductor package 6 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 27 2006
7,687,893 Semiconductor package having leadframe with exposed anchor pads 7 2006
7,829,990 Stackable semiconductor package including laminate interposer 2 2007
7,982,297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 4 2007
7,420,272 Two-sided wafer escape package 21 2007
7,723,210 Direct-write wafer level chip scale package 11 2007
7,977,774 Fusion quad flat semiconductor package 4 2007
7,687,899 Dual laminate package structure with embedded elements 8 2007
7,777,351 Thin stacked interposer package 63 2007
8,089,159 Semiconductor package with increased I/O density and method of making the same 1 2007
7,847,386 Reduced size stacked semiconductor package and method of making the same 0 2007
7,560,804 Integrated circuit package and method of making the same 2 2008
7,956,453 Semiconductor package with patterning layer and method of making same 1 2008
7,723,852 Stacked semiconductor package and method of making same 8 2008
8,067,821 Flat semiconductor package with half package molding 4 2008
7,768,135 Semiconductor package with fast power-up cycle and method of making same 4 2008
7,808,084 Semiconductor package with half-etched locking features 3 2008
8,125,064 Increased I/O semiconductor package and method of making same 0 2008
8,184,453 Increased capacity semiconductor package 2 2008
7,692,286 Two-sided fan-out wafer escape package 27 2008
7,847,392 Semiconductor device including leadframe with increased I/O 6 2008
7,989,933 Increased I/O leadframe and semiconductor device including same 2 2008
8,008,758 Semiconductor device with increased I/O leadframe 3 2008
8,089,145 Semiconductor device including increased capacity leadframe 1 2008
8,072,050 Semiconductor device with increased I/O leadframe including passive device 0 2008
7,875,963 Semiconductor device including leadframe having power bars and increased I/O 3 2008
7,982,298 Package in package semiconductor device 2 2008
8,487,420 Package in package semiconductor device with film over wire 0 2008
8,680,656 Leadframe structure for concentrated photovoltaic receiver package 0 2009
8,058,715 Package in package device for RF transceiver module 2 2009
7,732,899 Etch singulated semiconductor package 0 2009
8,026,589 Reduced profile stackable semiconductor package 9 2009
7,960,818 Conformal shield on punch QFN semiconductor package 0 2009
7,928,542 Lead frame for semiconductor package 2 2009
8,575,742 Semiconductor device with increased I/O leadframe including power bars 0 2009
7,977,163 Embedded electronic component package fabrication method 6 2009
8,089,141 Semiconductor package having leadframe with exposed anchor pads 0 2010
7,872,343 Dual laminate package structure with embedded elements 2 2010
8,188,584 Direct-write wafer level chip scale package 3 2010
7,932,595 Electronic component package comprising fan-out traces 9 2010
8,324,511 Through via nub reveal method and structure 1 2010
7,906,855 Stacked semiconductor package and method of making same 2 2010
8,294,276 Semiconductor device and fabricating method thereof 0 2010
8,084,868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8,319,338 Thin stacked interposer package 1 2010
8,440,554 Through via connected backside embedded circuit features structure and method 0 2010
8,487,445 Semiconductor device having through electrodes protruding from dielectric layer 0 2010
8,299,602 Semiconductor device including leadframe with increased I/O 0 2010
8,674,485 Semiconductor device including leadframe with downsets 0 2010
8,283,767 Dual laminate package structure with embedded elements 0 2010
8,188,579 Semiconductor device including leadframe having power bars and increased I/O 3 2010
8,390,130 Through via recessed reveal structure and method 1 2011
8,318,287 Integrated circuit package and method of making the same 2 2011
8,648,450 Semiconductor device including leadframe with a combination of leads and lands 0 2011
8,102,037 Leadframe for semiconductor package 0 2011
8,119,455 Wafer level package fabrication method 4 2011
8,441,110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 0 2011
8,304,866 Fusion quad flat semiconductor package 0 2011
8,432,023 Increased I/O leadframe and semiconductor device including same 0 2011
8,558,365 Package in package device for RF transceiver module 0 2011
8,227,921 Semiconductor package with increased I/O density and method of making same 1 2011
8,552,548 Conductive pad on protruding through electrode semiconductor device 0 2011
8,298,866 Wafer level package and fabrication method 2 2012
8,501,543 Direct-write wafer level chip scale package 0 2012
8,486,764 Wafer level package and fabrication method 0 2012
8,691,632 Wafer level package and fabrication method 0 2013
 
OVID DATA CO. LLC (39)
5,455,740 Bus communication system for stacked high density integrated circuit packages 80 1994
5,479,318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends 69 1995
5,493,476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends 50 1995
5,615,475 Method of manufacturing an integrated package having a pair of die on a common lead frame 22 1995
5,541,812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame 49 1995
RE36229 Simulcast standard multichip memory addressing system 25 1995
5,585,668 Integrated circuit package with overlapped die on a common lead frame 53 1996
5,778,522 Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 51 1996
6,205,654 Method of manufacturing a surface mount package 82 1998
6,288,907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 60 1999
6,608,763 Stacking system and method 37 2000
6,919,626 High density integrated circuit module 71 2001
6,462,408 Contact member stacking system and method 47 2001
6,576,992 Chip scale stacking system and method 100 2001
6,806,120 Contact member stacking system and method 7 2002
6,572,387 Flexible circuit connector for stacked chip module 72 2002
6,940,729 Integrated circuit stacking system and method 23 2002
7,485,951 Modularized die stacking system and method 2 2003
7,066,741 Flexible circuit connector for stacked chip module 46 2003
6,914,324 Memory expansion and chip scale stacking system and method 73 2003
7,026,708 Low profile chip scale stacking system and method 48 2003
7,371,609 Stacked module systems and methods 3 2004
6,955,945 Memory expansion and chip scale stacking system and method 7 2004
7,094,632 Low profile chip scale stacking system and method 38 2004
7,053,478 Pitch change and chip scale stacking system 89 2004
7,586,758 Integrated circuit stacking system 2 2004
7,335,975 Integrated circuit stacking system and method 2 2004
7,180,167 Low profile stacking system and method 28 2004
7,309,914 Inverted CSP stacking system and method 3 2005
7,202,555 Pitch change and chip scale stacking system and method 1 2005
7,033,861 Stacked module systems and method 48 2005
7,595,550 Flex-based circuit module 6 2005
7,656,678 Stacked module systems 0 2005
7,576,995 Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area 6 2005
7,508,058 Stacked integrated circuit module 0 2006
7,608,920 Memory card and method for devising 2 2006
7,508,069 Managed memory component 0 2006
7,304,382 Managed memory component 1 2006
7,468,553 Stackable micropackages and stacked modules 2 2007
 
CARDIAC PACEMAKERS, INC. (20)
6,477,412 Cardiac rhythm management system having multi-capacitor module 0 2000
6,674,634 Implantable heart monitors having flat capacitors with curved profiles 33 2002
7,479,349 Batteries including a flat plate design 11 2003
6,985,351 Implantable heart monitors having flat capacitors with curved profiles 21 2003
7,190,569 Implantable heart monitors having capacitors with endcap headers 8 2003
7,157,671 Flat capacitor for an implantable medical device 14 2004
7,072,713 Flat capacitor for an implantable medical device 16 2004
7,154,739 Flat capacitor having an active case 16 2004
7,301,753 Method and apparatus for a capacitor with flexible bus 4 2005
8,691,418 Insulative member on battery cathode 0 2005
7,224,575 Method and apparatus for high voltage aluminum capacitor design 16 2005
8,133,286 Method and apparatus for high voltage aluminum capacitor design 2 2007
7,656,646 Method and apparatus for a capacitor with a flexible interconnect 4 2007
8,543,201 Flat capacitor having staked foils and edge-connected connection members 0 2008
8,451,587 Method for interconnecting anodes and cathodes in a flat capacitor 0 2008
7,846,217 Method for a partially etched capacitor layer including a connection member 1 2009
8,174,818 Method for a capacitor with a flexible interconnect 2 2009
8,619,408 Sintered capacitor electrode including a folded connection 0 2010
8,503,164 Sintered capacitor electrode including a folded connection 0 2010
8,465,555 Method and apparatus for high voltage aluminum capacitor design 0 2012
 
UTAC HONG KONG LIMITED (14)
6,229,200 Saw-singulated leadless plastic chip carrier 323 1998
6,242,281 Saw-singulated leadless plastic chip carrier 249 1999
7,033,517 Method of fabricating a leadless plastic chip carrier 3 2003
7,091,581 Integrated circuit package and process for fabricating the same 41 2004
7,411,289 Integrated circuit package with partially exposed contact pads and process for fabricating the same 27 2004
7,595,225 Leadless plastic chip carrier with contact standoff 20 2004
7,732,914 Cavity-type integrated circuit package 0 2004
8,330,270 Integrated circuit package having a plurality of spaced apart pad portions 0 2004
7,270,867 Leadless plastic chip carrier 10 2004
7,358,119 Thin array plastic package without die attach pad and process for fabricating the same 22 2005
7,482,690 Electronic components such as thin array plastic packages and process for fabricating same 23 2005
7,348,663 Integrated circuit package and method for fabricating same 45 2005
7,410,830 Leadless plastic chip carrier and method of fabricating same 6 2005
7,344,920 Integrated circuit package and method for fabricating same 27 2007
 
INVENSAS CORPORATION (12)
6,188,126 Vertical interconnect process for silicon segments 5 1997
5,837,566 Vertical interconnect process for silicon segments 32 1997
5,994,170 Silicon segment programming method 10 1997
6,255,726 Vertical interconnect process for silicon segments with dielectric isolation 23 1997
6,124,633 Vertical interconnect process for silicon segments with thermally conductive epoxy preform 25 1997
6,080,596 Method for forming vertical interconnect process for silicon segments with dielectric isolation 45 1997
5,891,761 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform 58 1997
7,705,432 Three dimensional six surface conformal die coating 0 2004
7,215,018 Stacked die BGA or LGA component assembly 29 2005
7,245,021 Micropede stacked die component assembly 11 2005
8,357,999 Assembly having stacked die mounted on substrate 4 2007
7,535,109 Die assembly having electrical interconnect 8 2007
 
ROUND ROCK RESEARCH, LLC (11)
5,661,901 Method for mounting and electrically interconnecting semiconductor dice 45 1995
6,634,098 Methods for assembling, modifying and manufacturing a vertical surface mount package 1 1999
6,408,509 Vertically mountable interposer, assembly and method 4 1999
6,265,773 Vertically mountable and alignable semiconductor device, assembly, and methods 15 1999
6,512,290 Vertically mountable and alignable semiconductor device, assembly, and methods 7 2001
6,531,764 Vertically mountable semiconductor device, assembly, and methods 5 2001
6,684,493 Vertically mountable interposer, assembly and method 0 2002
6,734,529 Vertically mountable interposer and assembly 0 2002
6,963,128 Vertically mountable and alignable semiconductor device assembly 0 2003
7,082,681 Methods for modifying a vertical surface mount package 0 2003
7,569,418 Methods for securing packaged semiconductor devices to carrier substrates 0 2005
 
MICRON TECHNOLOGY, INC. (8)
5,867,367 Quad flat pack integrated circuit package 3 1997
6,326,687 IC package with dual heat spreaders 97 1998
6,518,098 IC package with dual heat spreaders 15 2001
7,166,915 Multi-chip module system 1 2001
6,730,526 Multi-chip module system and method of fabrication 1 2001
7,399,657 Ball grid array packages with thermally conductive containers 2 2002
6,765,291 IC package with dual heat spreaders 2 2002
6,920,688 Method for a semiconductor assembly having a semiconductor die with dual heat spreaders 2 2002
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (5)
5,397,747 Vertical chip mount memory package and method 44 1993
5,567,654 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging 93 1994
5,478,781 Polyimide-insulated cube package of stacked semiconductor device chips 82 1994
5,466,634 Electronic modules with interconnected surface metallization layers and fabrication methods therefore 67 1994
5,517,057 Electronic modules with interconnected surface metallization layers 42 1995
 
STAKTEK GROUP L.P. (5)
5,371,866 Simulcast standard multichip memory addressing system 39 1992
5,631,193 High density lead-on-package fabrication method 75 1995
5,552,963 Bus communication system for stacked high density integrated circuit packages 90 1995
5,588,205 Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails 49 1995
7,605,454 Memory card and method for devising 0 2007
 
ENTORIAN TECHNOLOGIES INC. (3)
6,049,123 Ultra high density integrated circuit packages 52 1997
6,025,642 Ultra high density integrated circuit packages 51 1997
6,168,970 Ultra high density integrated circuit packages 38 1999
 
ENTORIAN TECHNOLOGIES L.P. (3)
5,978,227 Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends 15 1996
5,960,539 Method of making high density integrated circuit module 27 1998
7,256,484 Memory expansion and chip scale stacking system and method 1 2004
 
SANDISK 3D LLC (3)
6,731,011 Memory module having interconnected and stacked integrated circuits 19 2002
7,005,730 Memory module having interconnected and stacked integrated circuits 14 2004
7,432,599 Memory module having interconnected and stacked integrated circuits 4 2006
 
FREESCALE SEMICONDUCTOR, INC. (2)
5,860,210 Method of manufacturing an electronic component 1 1996
5,747,858 Electronic component having an interconnect substrate adjacent to a side surface of a device substrate 5 1996
 
INTEL CORPORATION (2)
6,255,135 Quad flat pack integrated circuit package 2 1998
5,949,651 Quad flat pack integrated circuit package 2 1998
 
MITSUBISHI ELECTRIC CORPORATION (2)
5,754,405 Stacked dual in-line package assembly 29 1995
5,754,408 Stackable double-density integrated circuit assemblies 54 1995
 
MITSUBISHI ELECTRONICS AMERICA, INC. (2)
5,623,395 Integrated circuit package assembly 16 1995
5,790,381 Integrated circuit package assembly 16 1997
 
ADVANCED TECHNOLOGY INTERCONNECT INCORPORATED (1)
5,559,306 Electronic package with improved electrical performance 61 1995
 
ASUSTEK COMPUTER INC. (1)
8,543,801 Booting method using a backup memory in place of a failed main memory 0 2010
 
CUBIC MEMORY, INC. (1)
6,486,528 Silicon segment programming apparatus and three terminal fuse configuration 10 1999
 
Enthorian Technologies, LP (1)
7,606,048 Integrated circuit stacking system 2 2004
 
GENERAL ELECTRIC COMPANY (1)
5,657,537 Method for fabricating a stack of two dimensional circuit modules 70 1995
 
INTERNATIONAL RECTIFIER CORPORATION (1)
8,680,666 Bond wireless power module with double-sided single device cooling and immersion bath cooling 0 2007
 
NXP B.V. (1)
5,712,197 Method of manufacturing a semiconductor device suitable for surface mounting 4 1996
 
PAC TECH - PACKAGING TECHNOLOGIES GMBH (1)
7,087,442 Process for the formation of a spatial chip arrangement and spatial chip arrangement 7 2001
 
QTS, INC. (1)
6,242,285 Stacked package of semiconductor package units via direct connection between leads and stacking method therefor 11 1999
 
R-AMTECH INTERNATIONAL, INC. (1)
6,219,240 Three-dimensional electronic module and a method of its fabrication and repair 53 1999
 
RENESAS ELECTRONICS CORPORATION (1)
6,717,275 Semiconductor module 19 2002
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5,383,269 Method of making three dimensional integrated circuit interconnect module 18 1993
 
Stuktek Group L.P. (1)
7,193,310 Stacking system and method 9 2006
 
TEXAS INSTRUMENTS INCORPORATED (1)
5,619,067 Semiconductor device package side-by-side stacking and mounting system 40 1994
 
Thomson-CSF (1)
5,885,850 Method for the 3D interconnection of packages of electronic components, and device obtained by this method 18 1993
 
VLSI TECHNOLOGY, INC. (1)
5,905,300 Reinforced leadframe to substrate attachment 0 1997