Ultra high density integrated circuit packages method
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United States of America Patent
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-
Jan 18, 1994
Issued Date -
N/A
app pub date -
May 11, 1993
filing date -
Aug 1, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.
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