Ultra high density integrated circuit packages method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5279029
SERIAL NO

08059401

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STAKTEK GROUP L.P.AUSTIN, TX8

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burns, Carmen D Austin, TX 72 4278

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Micro Co., Ltd. (1)
* 4733461 Method of stacking printed circuit boards 155 1986
 
Saint-Gobain Vitrage (1)
* 4321418 Process for manufacture of solar photocell panels and panels obtained thereby 59 1980
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (7)
* 2004/0061,217 Thin and heat radiant semiconductor package and method for manufacturing 7 2003
* 2005/0139,980 High density integrated circuit module 4 2005
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* 2006/0033,190 Vertically mountable and alignable semiconductor device packages and assemblies including the same 1 2005
* 2009/0158,565 Method for a partially etched capacitor layer including a connection member 3 2009
* 2010/0095,496 METHOD FOR A CAPACITOR WITH A FLEXIBLE INTERCONNECT 2 2009
* 2010/0203,380 BATTERIES INCLUDING A FLAT PLATE DESIGN 7 2010
 
SONY CORPORATION (1)
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Advanced Cardiovascular Systems, Inc. (1)
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VLSI TECHNOLOGY, INC. (1)
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MICRON TECHNOLOGY, INC. (9)
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CUBIC MEMORY, INC. (1)
6486528 Silicon segment programming apparatus and three terminal fuse configuration 11 1999
 
SAMSUNG ELECTRONICS CO., LTD. (1)
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Thomson-CSF (1)
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Stuktek Group L.P. (1)
7193310 Stacking system and method 10 2006
 
R-AMTECH INTERNATIONAL, INC. (1)
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VIRGINIA COMMONWEALTH UNIVERSITY (1)
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UTAC HEADQUARTERS PTE. LTD. (13)
7033517 Method of fabricating a leadless plastic chip carrier 4 2003
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7732914 Cavity-type integrated circuit package 3 2004
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7270867 Leadless plastic chip carrier 16 2004
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TAMIRAS PER PTE. LTD., LLC (42)
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6462408 Contact member stacking system and method 47 2001
6576992 Chip scale stacking system and method 105 2001
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6572387 Flexible circuit connector for stacked chip module 73 2002
6940729 Integrated circuit stacking system and method 26 2002
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6914324 Memory expansion and chip scale stacking system and method 73 2003
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6955945 Memory expansion and chip scale stacking system and method 7 2004
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7053478 Pitch change and chip scale stacking system 112 2004
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7309914 Inverted CSP stacking system and method 3 2005
7202555 Pitch change and chip scale stacking system and method 1 2005
7033861 Stacked module systems and method 68 2005
7595550 Flex-based circuit module 23 2005
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7656678 Stacked module systems 1 2005
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7508058 Stacked integrated circuit module 0 2006
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7304382 Managed memory component 1 2006
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MITSUBISHI ELECTRONICS AMERICA, INC. (2)
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AMKOR TECHNOLOGY, INC. (191)
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6847103 Semiconductor package with exposed die pad and body-locking leadframe 12 1999
6476478 Cavity semiconductor package with exposed leads and die pad 10 1999
6448633 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 193 1999
6433277 Plastic integrated circuit package and method and leadframe for making the package 43 2000
7102208 Leadframe and semiconductor package with improved solder joint strength 5 2000
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6858919 Semiconductor package 85 2001
6759737 Semiconductor package including stacked chips with aligned input/output pads 45 2001
* 2002/0020,907 Semiconductor package 9 2001
6756658 Making two lead surface mounting high power microleadframe semiconductor packages 28 2001
7042068 Leadframe and semiconductor package made using the leadframe 12 2001
6611047 Semiconductor package with singulation crease 26 2001
6605865 Semiconductor package with optimized leadframe bonding strength 7 2001
6684496 Method of making an integrated circuit package 18 2001
6713322 Lead frame for semiconductor package 37 2001
6803645 Semiconductor package including flip chip 1 2001
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6885086 Reduced copper lead frame for saw-singulated chip package 9 2002
6700187 Semiconductor package and method for manufacturing the same 17 2002
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6627977 Semiconductor package including isolated ring structure 51 2002
6825062 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 11 2002
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6841414 Saw and etch singulation method for a chip package 39 2002
6867071 Leadframe including corner leads and semiconductor package using same 11 2002
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6919620 Compact flash memory card with clamshell leadframe 2 2002
6798047 Pre-molded leadframe 7 2002
6777789 Mounting for a package containing a chip 12 2003
6965159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 5 2003
6750545 Semiconductor package capable of die stacking 19 2003
6927483 Semiconductor package exhibiting efficient lead placement 52 2003
6794740 Leadframe package for semiconductor devices 13 2003
7095103 Leadframe based memory card 0 2003
6879034 Semiconductor package including low temperature co-fired ceramic substrate 13 2003
7045396 Stackable semiconductor package and method for manufacturing same 135 2003
7008825 Leadframe strip having enhanced testability 55 2003
6876068 Semiconductor package with increased number of input and output pins 72 2003
6897550 Fully-molded leadframe stand-off feature 5 2003
7485952 Drop resistant bumpers for fully molded memory cards 0 2003
6873041 Power semiconductor package with strap 20 2003
7071541 Plastic integrated circuit package and method and leadframe for making the package 4 2003
7245007 Exposed lead interposer leadframe package 77 2003
7057280 Leadframe having lead locks to secure leads to encapsulant 6 2003
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6846704 Semiconductor package and method for manufacturing the same 16 2003
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7144517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
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6965157 Semiconductor package with exposed die pad and body-locking leadframe 17 2003
7115445 Semiconductor package having reduced thickness 2 2004
7057268 Cavity case with clip/plug for use on multi-media card 21 2004
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7170150 Lead frame for semiconductor package 5 2004
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* 2008/0003,722 Transfer mold solution for molded multi-media card 0 2004
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7202554 Semiconductor package and its manufacturing method 22 2004
7045882 Semiconductor package including flip chip 7 2004
6953988 Semiconductor package 20 2004
7217991 Fan-in leadframe semiconductor package 15 2004
7253503 Integrated circuit device packages and substrates for making the packages 75 2004
7001799 Method of making a leadframe for semiconductor devices 7 2004
7064009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7030474 Plastic integrated circuit package and method and leadframe for making the package 7 2004
7176062 Lead-frame method and assembly for interconnecting circuits within a circuit module 0 2005
7214326 Increased capacity leadframe and semiconductor package using the same 5 2005
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7192807 Wafer level package and fabrication method 68 2005
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7507603 Etch singulated semiconductor package 20 2005
7361533 Stacked embedded leadframe 59 2005
7572681 Embedded electronic component package 59 2005
7112474 Method of making an integrated circuit package 4 2005
7564122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 2 2006
8410585 Leadframe and semiconductor package made using the leadframe 2 2006
7535085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7902660 Substrate for semiconductor device and manufacturing method thereof 89 2006
7968998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 13 2006
7321162 Semiconductor package having reduced thickness 7 2006
7332375 Method of making an integrated circuit package 4 2006
7521294 Lead frame for semiconductor package 7 2006
7714431 Electronic component package comprising fan-out and fan-in traces 48 2006
7687893 Semiconductor package having leadframe with exposed anchor pads 13 2006
7829990 Stackable semiconductor package including laminate interposer 7 2007
7982297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 8 2007
7420272 Two-sided wafer escape package 49 2007
7723210 Direct-write wafer level chip scale package 24 2007
7977774 Fusion quad flat semiconductor package 12 2007
7687899 Dual laminate package structure with embedded elements 18 2007
7777351 Thin stacked interposer package 202 2007
8089159 Semiconductor package with increased I/O density and method of making the same 8 2007
7847386 Reduced size stacked semiconductor package and method of making the same 1 2007
7560804 Integrated circuit package and method of making the same 7 2008
7956453 Semiconductor package with patterning layer and method of making same 5 2008
7723852 Stacked semiconductor package and method of making same 18 2008
8067821 Flat semiconductor package with half package molding 11 2008
7768135 Semiconductor package with fast power-up cycle and method of making same 11 2008
7808084 Semiconductor package with half-etched locking features 15 2008
8125064 Increased I/O semiconductor package and method of making same 5 2008
8184453 Increased capacity semiconductor package 13 2008
7692286 Two-sided fan-out wafer escape package 48 2008
7847392 Semiconductor device including leadframe with increased I/O 11 2008
7989933 Increased I/O leadframe and semiconductor device including same 9 2008
8008758 Semiconductor device with increased I/O leadframe 8 2008
8089145 Semiconductor device including increased capacity leadframe 3 2008
8072050 Semiconductor device with increased I/O leadframe including passive device 2 2008
7875963 Semiconductor device including leadframe having power bars and increased I/O 16 2008
7982298 Package in package semiconductor device 20 2008
8487420 Package in package semiconductor device with film over wire 1 2008
8680656 Leadframe structure for concentrated photovoltaic receiver package 5 2009
8058715 Package in package device for RF transceiver module 5 2009
7732899 Etch singulated semiconductor package 4 2009
8026589 Reduced profile stackable semiconductor package 28 2009
7960818 Conformal shield on punch QFN semiconductor package 7 2009
7928542 Lead frame for semiconductor package 7 2009
8575742 Semiconductor device with increased I/O leadframe including power bars 6 2009
7977163 Embedded electronic component package fabrication method 19 2009
8796561 Fan out build up substrate stackable package and method 8 2009
8937381 Thin stackable package and method 9 2009
9691734 Method of forming a plurality of electronic component packages 0 2009
8089141 Semiconductor package having leadframe with exposed anchor pads 1 2010
7872343 Dual laminate package structure with embedded elements 9 2010
8188584 Direct-write wafer level chip scale package 28 2010
7932595 Electronic component package comprising fan-out traces 22 2010
8324511 Through via nub reveal method and structure 7 2010
7906855 Stacked semiconductor package and method of making same 3 2010
8294276 Semiconductor device and fabricating method thereof 4 2010
8084868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8319338 Thin stacked interposer package 53 2010
8440554 Through via connected backside embedded circuit features structure and method 4 2010
8487445 Semiconductor device having through electrodes protruding from dielectric layer 3 2010
8299602 Semiconductor device including leadframe with increased I/O 0 2010
8791501 Integrated passive device structure and method 4 2010
8674485 Semiconductor device including leadframe with downsets 2 2010
8283767 Dual laminate package structure with embedded elements 3 2010
8188579 Semiconductor device including leadframe having power bars and increased I/O 14 2010
8390130 Through via recessed reveal structure and method 8 2011
8318287 Integrated circuit package and method of making the same 6 2011
8648450 Semiconductor device including leadframe with a combination of leads and lands 1 2011
8102037 Leadframe for semiconductor package 1 2011
8119455 Wafer level package fabrication method 11 2011
8729710 Semiconductor package with patterning layer and method of making same 0 2011
8729682 Conformal shield on punch QFN semiconductor package 0 2011
8441110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 4 2011
8304866 Fusion quad flat semiconductor package 1 2011
8432023 Increased I/O leadframe and semiconductor device including same 1 2011
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8558365 Package in package device for RF transceiver module 1 2011
8227921 Semiconductor package with increased I/O density and method of making same 4 2011
8552548 Conductive pad on protruding through electrode semiconductor device 3 2011
8298866 Wafer level package and fabrication method 8 2012
9704725 Semiconductor device with leadframe configured to facilitate reduced burr formation 0 2012
9129943 Embedded component package and fabrication method 0 2012
9048298 Backside warpage control structure and fabrication method 2 2012
8501543 Direct-write wafer level chip scale package 4 2012
8486764 Wafer level package and fabrication method 5 2012
9324614 Through via nub reveal method and structure 0 2012
8853836 Integrated circuit package and method of making the same 1 2012
9082833 Through via recessed reveal structure and method 0 2013
9362210 Leadframe and semiconductor package made using the leadframe 0 2013
9159672 Through via connected backside embedded circuit features structure and method 0 2013
8691632 Wafer level package and fabrication method 4 2013
8900995 Semiconductor device and manufacturing method thereof 0 2013
8981572 Conductive pad on protruding through electrode semiconductor device 0 2013
8710649 Wafer level package and fabrication method 4 2013
9275939 Semiconductor device including leadframe with a combination of leads and lands and method 0 2013
8963301 Integrated circuit package and method of making the same 0 2013
8952522 Wafer level package and fabrication method 0 2014
9184118 Micro lead frame structure having reinforcing portions and method 1 2014
9184148 Semiconductor package and method therefor 0 2014
9054117 Wafer level package and fabrication method 1 2014
9224676 Integrated circuit package and method of making the same 0 2015
9431323 Conductive pad on protruding through electrode 0 2015
9406645 Wafer level package and fabrication method 1 2015
9673122 Micro lead frame structure having reinforcing portions and method 0 2015
9543235 Semiconductor package and method therefor 0 2015
9508631 Semiconductor device including leadframe with a combination of leads and lands and method 0 2015
9631481 Semiconductor device including leadframe with a combination of leads and lands and method 0 2016
 
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RENESAS ELECTRONICS CORPORATION (1)
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INTEL CORPORATION (4)
6255135 Quad flat pack integrated circuit package 2 1998
* 5949651 Quad flat pack integrated circuit package 3 1998
* 9312233 Method of forming molded panel embedded die structure 1 2013
* 2015/0003,000 METHODS OF FORMING MOLDED PANEL EMBEDDED DIE STRUCTURES 1 2013
 
MITSUBISHI ELECTRIC CORPORATION (2)
* 5754405 Stacked dual in-line package assembly 30 1995
* 5754408 Stackable double-density integrated circuit assemblies 55 1995
 
ENTORIAN TECHNOLOGIES L.P. (6)
* 5978227 Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends 15 1996
* 5960539 Method of making high density integrated circuit module 29 1998
7256484 Memory expansion and chip scale stacking system and method 2 2004
* 2006/0131,716 Stacking system and method 4 2005
* 2009/0170,243 Stacked Integrated Circuit Module 0 2009
* 2009/0273,069 LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD 0 2009
 
ADVANCED TECHNOLOGY INTERCONNECT INCORPORATED (1)
* 5559306 Electronic package with improved electrical performance 63 1995
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 5619067 Semiconductor device package side-by-side stacking and mounting system 41 1994
 
Enthorian Technologies, LP (1)
7606048 Integrated circuit stacking system 3 2004
 
UTAC HONG KONG LIMITED (2)
6229200 Saw-singulated leadless plastic chip carrier 386 1998
6242281 Saw-singulated leadless plastic chip carrier 301 1999
* Cited By Examiner