Method for fabricating stacks of IC chips by segmenting a larger stack
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United States of America Patent
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Jan 18, 1994
Issued Date -
N/A
app pub date -
Dec 24, 1992
filing date -
May 15, 1992
priority date (Note) -
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Abstract
A method for fabricating stacks of IC chips into modules providing high density electronics. A relatively large number of layers are stacked, and then integrated by curing adhesive applied between adjacent layers. A large stack is formed, various processing steps are performed on the access plane face of the large stack, and then the large stack is segmented to form a plurality of smaller, or short, stacks. Means are provided for causing separation of the larger stack into smaller stacks, without disturbing the adhesive which binds the layers within each small stack.
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