Method of producing a wafer having a curved notch
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United States of America Patent
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Jan 18, 1994
Issued Date -
N/A
app pub date -
Mar 25, 1992
filing date -
Jul 30, 1982
priority date (Note) -
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Importance
Abstract
A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epitaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.
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