Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5280156
SERIAL NO

07811946

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wafer heating apparatus can be obtained which prevents formation of a local gap caused by deflection or distortion, and the like, of a wafer at the time of heating the wafer so as to improve production yield of the heat treatment of the wafers. The apparatus includes a ceramic substrate, a heat generating resistive element embedded in the ceramic substrate, a film electrode formed on a front surface of the ceramic substrate, and a ceramic dielectric layer formed on the front surface of the ceramic substrate to coat the film electrode. A direct current power source is provided to generate Coulomb's force between the wafer and the film electrode via the dielectric layer to attract the wafer to a wafer-attracting surface of the dielectric layer, while heating the wafer attracted to the wafer-attracting surface by energizing the heat generating element through application of an electric current therethrough. A method of producing the wafer heating apparatus is also disclosed.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NGK INSULATORS, LTD.NAGOYA2148

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Niori, Yusuke Nagoya, JP 5 392
Nobori, Kazuhiro Haguri, JP 52 1022
Umemoto, Koichi Toyota, JP 18 509
Ushikoshi, Ryusuke Handa, JP 26 890

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

Patent Citation Ranking

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