Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means

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United States of America Patent

PATENT NO 5280156
SERIAL NO

07811946

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Abstract

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A wafer heating apparatus can be obtained which prevents formation of a local gap caused by deflection or distortion, and the like, of a wafer at the time of heating the wafer so as to improve production yield of the heat treatment of the wafers. The apparatus includes a ceramic substrate, a heat generating resistive element embedded in the ceramic substrate, a film electrode formed on a front surface of the ceramic substrate, and a ceramic dielectric layer formed on the front surface of the ceramic substrate to coat the film electrode. A direct current power source is provided to generate Coulomb's force between the wafer and the film electrode via the dielectric layer to attract the wafer to a wafer-attracting surface of the dielectric layer, while heating the wafer attracted to the wafer-attracting surface by energizing the heat generating element through application of an electric current therethrough. A method of producing the wafer heating apparatus is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTD2-56 SUDA-CHO MIZUHO-KU NAGOYA-CITY AICHI-PREFECTURE 467-8530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Niori, Yusuke Nagoya, JP 5 400
Nobori, Kazuhiro Haguri, JP 52 1135
Umemoto, Koichi Toyota, JP 18 523
Ushikoshi, Ryusuke Handa, JP 26 947

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