Three-dimensional memory card structure with internal direct chip attachment
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United States of America Patent
Stats
-
Jan 18, 1994
Issued Date -
N/A
app pub date -
Jan 29, 1992
filing date -
Apr 30, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A card structure has an internal three dimensional array of implanted semiconductor chips. The card structure includes a power core and a plurality of chip cores. Each chip core is joined to the power core on opposite surfaces of the power core, and each chip core includes a compensator core having a two dimensional array of chip wells. Each chip well allows for a respective one of the semiconductor chips to be implanted therein. Further, a compliant dielectric material is disposed on the major surfaces of the compensator core except at the bottoms of the chip wells. The compliant dielectric material has a low dielectric constant and has a thermal coefficient of expansion compatible with those of the semiconductor chips and the compensator core, so that thermal expansion stability with the chips and the compensator core is maintained.
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