IC test instrument
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United States of America Patent
Stats
-
Jan 18, 1994
Grant Date -
N/A
app pub date -
Jan 22, 1992
filing date -
Jul 23, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC test instrument has an IC test circuit for an integrated semiconductor chip. A probe card is coupled to the IC test circuit. Probe needles are disposed on the probe card. The probe needles comprise a cobalt-based alloy containing at least 10 weight-percent of chromium. A passive-state film comprised of chromium oxide is formed on one end of the probe needles, and a solder-enhancing metallic layer is formed on the other end of the probe needles. The passive-state film may be formed by electrolytic polishing or chemical solution immersion. The passive-state film prevents a contaminating substance, such as aluminum oxide, from adhering to the needle. The probe needle substrate may be bent and may be formed by wiredrawing a cobalt-based alloy.
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