Circuit assembly having interposer lead frame
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United States of America Patent
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-
Feb 1, 1994
Grant Date -
N/A
app pub date -
Dec 4, 1992
filing date -
Dec 4, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit assembly includes a finger lead assembly having structure for supporting an interposer substrate assembly and an electronic circuit device, the substrate assembly having conductive elements for providing electrical connection between finger leads of the lead assembly and respective circuit sections within the circuit device. The circuit device is mounted proximate to an upper surface of the substrate assembly. At least one decoupling capacitor is mounted on a lower surface of the substrate assembly at a level below that of the finger leads and electrically connected, through circuitry within the substrate assembly including inter-level via connectors, to respective circuits within the circuit device.
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