US Patent No: 5,284,561

Number of patents in Portfolio can not be more than 2000

Method and apparatus for sputter coating employing machine readable indicia carried by target assembly

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Importance

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Abstract

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An expendable target of sputter coating material is provided having secured thereto a storage medium having recorded thereon, in machine readable indicia, information relating to a characteristic of the target. The information preferably includes target identifying information and may also include information relating to the target composition, the history of the use of the target, and other information usable by the apparatus to automatically set machine parameters or to record process information. Information, particularly of the use of the target, may be updated and written to a medium on the target or target assembly, or to a machine readable medium which may be affixed to the target assembly when the target is removed. The apparatus preferably includes a read head in the sputtering chamber and may also include a write head for writing information to the target assembly. A memory and microprocessor cooperate with the machine control to utilize the information read from the target in the control of the sputtering apparatus.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TOKYO ELECTRON LIMITEDTOKYO4816

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hurwitt, Steven Park Ridge, NJ 25 325
Shinneman, Frank M Ridgewood, NJ 2 19

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TOKYO ELECTRON LIMITED (2)
* 4,957,605 Method and apparatus for sputter coating stepped wafers 80 1989
* 5,126,028 Sputter coating process control method and apparatus 59 1990
 
ALUMINIUM PECHINEY (1)
* 4,756,814 Method for the individual marking of precooked anodes for the electrolytic production of aluminum 7 1987
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
TOKYO ELECTRON LIMITED (4)
* 5,449,445 Sputtering target with machine readable indicia 8 1993
6,689,254 Sputtering apparatus with isolated coolant and sputtering target therefor 3 1995
6,416,635 Method and apparatus for sputter coating with variable target to substrate spacing 8 1995
6,623,606 Method and apparatus for sputter coating with variable target to substrate spacing 2 2002
 
LAM RESEARCH CORPORATION (3)
* 6,350,317 Linear drive system for use in a plasma processing system 24 1999
6,669,811 Linear drive system for use in a plasma processing system 7 2001
6,863,784 Linear drive system for use in a plasma processing system 8 2003
 
PRAXAIR S.T. TECHNOLOGY, INC. (2)
* 5,490,914 High utilization sputtering target for cathode assembly 11 1995
* 5,846,389 Sputtering target protection device 7 1997
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 6,286,452 Sputtering apparatus 3 1999
 
TAKEDA PHARMACEUTICAL COMPANY LIMITED (1)
* 5,958,961 Pharmaceutical composition for angiotensin II-mediated diseases 7 1997
* Cited By Examiner