Method and apparatus for sputter coating employing machine readable indicia carried by target assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5284561
SERIAL NO

07791415

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An expendable target of sputter coating material is provided having secured thereto a storage medium having recorded thereon, in machine readable indicia, information relating to a characteristic of the target. The information preferably includes target identifying information and may also include information relating to the target composition, the history of the use of the target, and other information usable by the apparatus to automatically set machine parameters or to record process information. Information, particularly of the use of the target, may be updated and written to a medium on the target or target assembly, or to a machine readable medium which may be affixed to the target assembly when the target is removed. The apparatus preferably includes a read head in the sputtering chamber and may also include a write head for writing information to the target assembly. A memory and microprocessor cooperate with the machine control to utilize the information read from the target in the control of the sputtering apparatus.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TOKYO ELECTRON LIMITEDTOKYO5214

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hurwitt, Steven Park Ridge, NJ 24 367
Shinneman, Frank M Ridgewood, NJ 2 19

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ALUMINIUM PECHINEY (1)
* 4756814 Method for the individual marking of precooked anodes for the electrolytic production of aluminum 7 1987
 
TOKYO ELECTRON LIMITED (2)
* 4957605 Method and apparatus for sputter coating stepped wafers 85 1989
* 5126028 Sputter coating process control method and apparatus 62 1990
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2004/0108,301 Linear drive system for use in a plasma processing system 2 2003
 
LAM RESEARCH CORPORATION (3)
* 6350317 Linear drive system for use in a plasma processing system 34 1999
6669811 Linear drive system for use in a plasma processing system 8 2001
6863784 Linear drive system for use in a plasma processing system 8 2003
 
PRAXAIR S.T. TECHNOLOGY, INC. (2)
* 5490914 High utilization sputtering target for cathode assembly 11 1995
* 5846389 Sputtering target protection device 7 1997
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 6286452 Sputtering apparatus 4 1999
 
TOKYO ELECTRON LIMITED (4)
* 5449445 Sputtering target with machine readable indicia 8 1993
6689254 Sputtering apparatus with isolated coolant and sputtering target therefor 6 1995
6416635 Method and apparatus for sputter coating with variable target to substrate spacing 9 1995
6623606 Method and apparatus for sputter coating with variable target to substrate spacing 3 2002
 
TAKEDA PHARMACEUTICAL COMPANY LIMITED (1)
* 5958961 Pharmaceutical composition for angiotensin II-mediated diseases 10 1997
* Cited By Examiner