Process for flip chip connecting a semiconductor chip
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United States of America Patent
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Feb 8, 1994
Grant Date -
N/A
app pub date -
Sep 2, 1992
filing date -
Sep 10, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.
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