Semiconductor die packages having lead support frame
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 8, 1994
Issued Date -
N/A
app pub date -
Jul 9, 1992
filing date -
Dec 7, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is tested and packaged.
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