Heat sink plate for multiple semi-conductors
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United States of America Patent
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Feb 8, 1994
Grant Date -
N/A
app pub date -
Aug 28, 1992
filing date -
Aug 28, 1992
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A heat sink comprising a thin plate made of a heat conducting material, which plate includes a series of small tapered chimneys extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board, thermally connecting with the semiconductors on the board, the chimneys being spaced inbetween the semiconductors and facilitating natural or forced airflow from the area between the plate and the printed circuit board to the area outside by means of the low pressure drop created by their tapering, the heat sink taking very little vertical space in the electronics package including the printed circuit board while providing effective heat dissipation and shielding from electro-magnetic radiation and/or radio frequency interference for the semiconductors on the board.
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