Pressure sensor having a laminated substrate
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United States of America Patent
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Feb 15, 1994
Grant Date -
N/A
app pub date -
Jan 24, 1992
filing date -
Jan 24, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.
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