Method of forming EMI shielded enclosures, EMI shielded enclosures and EMI shields
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United States of America Patent
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Feb 15, 1994
Issued Date -
N/A
app pub date -
Dec 9, 1991
filing date -
Apr 4, 1990
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming EMI shielded enclosures, an EMI shielded enclosure and EMI shield are provided. A sealer composition is applied onto a surface and is allowed to substantially dry cure into a uniform, seamless layer. An adhesive composition is applied to the dried sealer composition. Then, an electrically-conductive material, such as metallic sheet, such as copper sheeting, is attached to the dried sealer composition by the adhesive composition. Alternatively, a bonded sheet of dielectric material is applied to the adhesive composition. Then the metallic sheet is attached to the bonded sheet of dielectric material by an adhesive composition second layer.
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