Process for the formation of a negative resist pattern from a composition comprising a diazoquinone compound and an imidazole and having as a heat step the use of a hot water containing spray
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United States of America Patent
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Feb 15, 1994
Issued Date -
N/A
app pub date -
Jan 14, 1992
filing date -
Nov 1, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A negative resist pattern is formed using a resist containing a diazoquinone sensitizer. An imagewise exposed area of a layer of the resist is subjected to heat treatment with a water-containing heating medium in the presence of a carboxyl-inactivating agent. The entire surface of the layer is exposed to radiation. The thus-exposed surface is then treated with an alkaline developer solution. An apparatus suitable for use in the practice of the above process is also disclosed.
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