Semiconductor die packages having lead support frame
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United States of America Patent
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Feb 15, 1994
Issued Date -
N/A
app pub date -
Jul 9, 1992
filing date -
Dec 7, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for forming a lead pack including a frame of electrical insulating material with a plurality of spaced embedded leads extending inwardly and outwardly from said frame. Additionaly connecting the inwardly extending leads to the contact pads of a semiconductor device and the outwardly extending leads to a transport tape for testing.
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