System with cooling of electronic components on a circuit board
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United States of America Patent
Stats
-
Feb 22, 1994
Issued Date -
N/A
app pub date -
Nov 9, 1992
filing date -
Jun 7, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The system includes a circuit board on which electrical components are mounted. The components are mounted on the front side of the board, and the back side of the board is thermally coupled to the housing by a liquid-filled thermal heat sink pouch between the board and the housing. A heat generating component such as a microprocessor is mounted to the front side of the board, but the top surface of the component is directed toward the back side of the board such that it is also thermally coupled to the housing.
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