Film-type resistor assembly with full encapsulation except at the bottom surface
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United States of America Patent
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Mar 1, 1994
Issued Date -
N/A
app pub date -
Mar 17, 1992
filing date -
Apr 10, 1991
priority date (Note) -
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Abstract
A film-type resistor having a high power rating and a relatively low manufacturing cost. The structural strength of the resistor is derived primarily from a molded body that covers both a film-coated substrate and a heatsink. The heatsink, to which the substrate is bonded in high thermal-conductivity relationship, has an exposed flat bottom surface of relatively large area.
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