Semiconductors structure precision lapping method and system
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United States of America Patent
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-
Mar 8, 1994
Grant Date -
N/A
app pub date -
Aug 20, 1992
filing date -
Aug 20, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus in the form an N.sub.2 gas gun (30) improves the lapping of a semiconductor device (22) by lapping equipment (10) by an associating a predetermined location (32) on the lapping surface (20) with the semiconductor device (22). Compressed N.sub.2 gas flows through a nozzle device (30) to the predetermined location (32) on the lapping surface (20). Nozzle holder (28) holds the N.sub.2 gas gun (30) in a position for the compressed gas to blow particulate from predetermined location (32) prior to the predetermined location (32) associating with the semiconductor device (22).
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