Electroless palladium plating composition
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United States of America Patent
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Mar 8, 1994
Grant Date -
N/A
app pub date -
Jul 30, 1992
filing date -
Aug 2, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/l of a hypophosphite compound, (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia and alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100000 and (5) 0.01-10 g/l of an aliphatic alkyenylamine, and which is used at a pH in the range of 5-10.
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