Substrates used in multilayered integrated circuits and multichips
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United States of America Patent
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-
Mar 8, 1994
Issued Date -
N/A
app pub date -
Mar 30, 1992
filing date -
Apr 3, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for making a substrate for use in a multilayered integrated circuit or multichip module which includes coating a conductive material on a surface of a support sheet to form a conductive circuit and then drying the sheet. Next, a coating of a layer of dielectric layer is placed on the support surface in the areas where the conductive material is not cast. After which the coated sheet is densified to form a densified conductive circuit embedded dielectric layer. A second coating of a dielectric is placed over the first densified conductive circuit embedded dielectric layer such that the second layer is characterized by vias therein which are in register with at least a portion of the conductive circuit. The vias in the second dielectric layer are filled to form electrically conductive vias and then densifying to form the substrate.
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