US Patent No: 5,292,558

Number of patents in Portfolio can not be more than 2000

Process for metal deposition for microelectronic interconnections

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Abstract

A method for forming interconnections in microelectronic devices, including interconnections through small vias between different layers in the microelectronic devices include the spin coating of a film comprising a polyoxometalate and an organic material on the substrate. The film is optionally patterned by lithography, the polymer is removed, and the polyoxometalate is reduced to a metal layer. The metal layer may in one embodiment provide a nucleating zone for the deposition of metal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMAUSTIN, TX2784

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Argitis, Panagiotis Mellaala, Attiki, GR 10 104
Carls, Joseph C Austin, TX 16 144
Heller, Adam Austin, TX 508 25247

Cited Art

Patent Info (Count) # Cites Year
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (2)
4,843,034 Fabrication of interlayer conductive paths in integrated circuits 52 1988
5,087,589 Selectively programmable interconnections in multilayer integrated circuits 77 1989
 
AT&T BELL LABORATORIES (1)
5,026,666 Method of making integrated circuits having a planarized dielectric 53 1989
 
CANON KABUSHIKI KAISHA (1)
4,914,052 Process for the formation of a functional deposited film containing groups III and V atoms by microwave plasma chemical vapor deposition process 16 1989
 
GENERAL ELECTRIC COMPANY (1)
4,865,873 Electroless deposition employing laser-patterned masking layer 58 1987
 
KABUSHIKI KAISHA TOSHIBA (1)
4,694,138 Method of forming conductor path 29 1984

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
NEOCONIX, INC. (18)
7,056,131 Contact grid array system 21 2003
7,113,408 Contact grid array formed on a printed circuit board 18 2003
7,244,125 Connector for making electrical contact at semiconductor scales 30 2003
7,025,601 Interposer and method for making same 18 2004
7,347,698 Deep drawn electrical contacts and method for making 3 2004
7,090,503 Interposer with compliant pins 17 2004
7,597,561 Method and system for batch forming spring elements in three dimensions 2 2005
7,383,632 Method for fabricating a connector 2 2005
7,357,644 Connector having staggered contact architecture for enhanced working range 2 2005
7,645,147 Electrical connector having a flexible sheet and one or more conductive connectors 3 2006
7,354,276 Interposer with compliant pins 7 2006
7,587,817 Method of making electrical connector on a flexible carrier 2 2006
7,628,617 Structure and process for a contact grid array formed in a circuitized substrate 2 2006
7,371,073 Contact grid array system 17 2007
7,989,945 Spring connector for making electrical contact at semiconductor scales 4 2007
7,758,351 Method and system for batch manufacturing of spring elements 5 2007
7,621,756 Contact and method for making same 3 2007
7,891,988 System and method for connecting flat flex cable with an integrated circuit, such as a camera module 1 2009
 
APPLIED MATERIALS, INC. (15)
5,877,087 Low temperature integrated metallization process and apparatus 34 1995
6,066,358 Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer 29 1996
6,537,905 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug 12 1996
6,139,697 Low temperature integrated via and trench fill process and apparatus 69 1997
6,139,905 Integrated CVD/PVD Al planarization using ultra-thin nucleation layers 5 1997
5,877,086 Metal planarization using a CVD wetting film 33 1997
5,989,623 Dual damascene metallization 103 1997
6,355,560 Low temperature integrated metallization process and apparatus 6 1998
6,726,776 Low temperature integrated metallization process and apparatus 4 1999
6,207,222 Dual damascene metallization 66 1999
6,207,558 Barrier applications for aluminum planarization 36 1999
6,458,684 Single step process for blanket-selective CVD aluminum deposition 8 2000
6,368,880 Barrier applications for aluminum planarization 13 2001
6,743,714 Low temperature integrated metallization process and apparatus 1 2002
7,112,528 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug 3 2003
 
BOSTON SCIENTIFIC SCIMED, INC. (15)
8,089,029 Bioabsorbable metal medical device and method of manufacture 0 2006
8,048,150 Endoprosthesis having a fiber meshwork disposed thereon 1 2006
8,052,743 Endoprosthesis with three-dimensional disintegration control 0 2007
8,052,744 Medical devices and methods of making the same 0 2007
8,052,745 Endoprosthesis 0 2007
8,002,821 Bioerodible metallic ENDOPROSTHESES 3 2007
8,128,689 Bioerodible endoprosthesis with biostable inorganic layers 0 2007
8,057,534 Bioerodible endoprostheses and methods of making the same 2 2007
7,955,382 Endoprosthesis with adjustable surface features 2 2007
8,080,055 Bioerodible endoprostheses and methods of making the same 0 2007
7,998,192 Endoprostheses 0 2008
8,236,046 Bioerodible endoprosthesis 0 2008
7,985,252 Bioerodible endoprosthesis 0 2008
8,382,824 Medical implant having NANO-crystal grains with barrier layers of metal nitrides or fluorides 0 2008
8,267,992 Self-buffering medical implants 0 2010
 
SIMON FRASER UNIVERSITY (4)
6,566,276 Method of making electronic materials 16 2001
7,427,529 Deposition of permanent polymer structures for OLED fabrication 0 2003
7,074,640 Method of making barrier layers 4 2003
7,176,114 Method of depositing patterned films of materials using a positive imaging process 2 2003
 
MATTSON TECHNOLOGY, INC. (2)
6,875,691 Temperature control sequence of electroless plating baths 6 2002
6,797,312 Electroless plating solution and process 28 2003
 
EMORY UNIVERSITY (1)
7,691,289 Compositions, materials incorporating the compositions, and methods of using the compositions, and methods of using the compositions and materials 1 2004
 
GEORGIA TECH RESEARCH CORPORATION (1)
6,696,363 Method of and apparatus for substrate pre-treatment 12 2001
 
INFINEON TECHNOLOGIES AG (1)
6,380,094 Method for preventing redeposition of etching products onto substrate surfaces during a tungsten re-etching process in the production of LSI circuits 0 1995
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
7,060,624 Deep filled vias 4 2003
 
NIPPON MINING & METALS CO., LTD. (1)
8,004,082 Electronic component formed with barrier-seed layer on base material 0 2009
 
REMON MEDICAL TECHNOLOGIES LTD. (1)
8,303,643 Method and device for electrochemical formation of therapeutic species in vivo 0 2010
 
SIMON FOSTER UNIVERSITY (1)
7,067,346 Titanium carboxylate films for use in semiconductor processing 1 2003
 
SPANSION LLC (1)
6,246,118 Low dielectric semiconductor device with rigid, conductively lined interconnection system 23 1999
 
THE REGENTS OF THE UNIVERSITY OF MICHIGAN (1)
5,413,668 Method for making mechanical and micro-electromechanical devices 19 1993
 
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY (1)
6,723,349 Polyoxometalate materials, metal-containing materials, and methods of use thereof 12 2000
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
7,625,220 System for connecting a camera module, or like device, using flat flex cables 1 2006