Process for metal deposition for microelectronic interconnections

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5292558
SERIAL NO

07742391

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for forming interconnections in microelectronic devices, including interconnections through small vias between different layers in the microelectronic devices include the spin coating of a film comprising a polyoxometalate and an organic material on the substrate. The film is optionally patterned by lithography, the polymer is removed, and the polyoxometalate is reduced to a metal layer. The metal layer may in one embodiment provide a nucleating zone for the deposition of metal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMAUSTIN, TX2258

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Argitis, Panagiotis Piraeus, GR 8 131
Carls, Joseph C Austin, TX 25 200
Heller, Adam Austin, TX 452 63128

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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AT&T Bell Laboratories (1)
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CANON KABUSHIKI KAISHA (1)
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* Cited By Examiner

Patent Citation Ranking

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