Method for forming vias in multilayer circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 8, 1994
Issued Date -
N/A
app pub date -
Aug 1, 1991
filing date -
Aug 1, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention is directed to a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses. Beam positioning is controlled by means of a programmed galvanometric beam positioner. The drilling sequence is optionally controlled by application of an heuristic algorithm of the symmetric Traveling Salesman Problem.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully