Ceramic-glass IC package assembly having multiple conductive layers
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United States of America Patent
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Mar 8, 1994
Grant Date -
N/A
app pub date -
Nov 12, 1992
filing date -
Nov 15, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A ceramic base of an IC package has a laminated structure and has two conductive layers sandwiched between insulating ceramic layers. One of the conductive layers is used as a power source layer and electrically connects a plurality of power source terminals of an IC chip to a single power source lead. The other conductive layer is used as an earth layer and electrically connects a plurality of earth terminals of the IC chip to a single earth lead.
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