Method of and apparatus for manufacturing semiconductor device
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United States of America Patent
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Mar 15, 1994
Issued Date -
N/A
app pub date -
Nov 10, 1992
filing date -
Nov 12, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to an apparatus for manufacturing a semiconductor device, which has an auxiliary bonding stage in the vicinity of a wafer stage so that when a wire is disconnected during a bonding operation of a ball bump by wire bonding, the wire can be easily restored to the normal state without using an IC chip on a wafer, and a method of manufacturing a semiconductor device, which comprises the steps of moving a capillary above the auxiliary bonding stage after wire disconnection occurs, pulling out the wire from the capillary above the auxiliary bonding stage, forming a ball at a distal cut end of the wire which is pulled out, and performing ball bump bonding on an electrode of an IC chip placed on the wafer stage with the wire formed with the ball at its distal cut end.
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