Method for forming via holes in multilayer circuits

United States of America Patent

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Mar 15, 1994
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N/A
app pub date
Oct 8, 1993
filing date
Jan 8, 1993

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Expired

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Abstract

The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

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Patent Owner(s)

Patent Owner	Address
E I DU PONT NEMOURS AND COMPANY	LEGAL PATENTS BARLEY MILL PLAZA 25 WILMINGTON DE 19880-0025

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Dorfman, Jay R	Durham, NC	3	87
Draudt, Richard R	Pittsboro, NC	2	46
Lantzer, Thomas D	Fuquay-Varina, NC	12	168
Mones, Arthur H	Cary, NC	8	144
Sutton, David L	Raleigh, NC	18	1046

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Method for forming via holes in multilayer circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

08002247

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PATENT NO	5294567
SERIAL NO	08002247
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08002247

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