Method for forming via holes in multilayer circuits

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United States of America Patent

PATENT NO 5294567
SERIAL NO

08002247

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

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Patent Owner(s)

  • E. I. DU PONT DE NEMOURS AND COMPANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dorfman, Jay R Durham, NC 3 87
Draudt, Richard R Pittsboro, NC 2 46
Lantzer, Thomas D Fuquay-Varina, NC 12 155
Mones, Arthur H Cary, NC 8 144
Sutton, David L Raleigh, NC 18 1040

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