Printed wiring board having shielding layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 15, 1994
Issued Date -
N/A
app pub date -
Oct 4, 1991
filing date -
Mar 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed wiring board having a shielding layer for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion, a printed wiring circuit provided on one or both surfaces of the insulating sheet, an insulating layer having a thickness of 20.about.50 .mu.m which is provided on the printed wiring circuit, and an electromagnetic shielding layer provided on the insulating layer.
First Claim
Family
International Classification(s)
- Non-US Classification not provided for expired patents
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided for expired patents
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