Semiconductor device
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United States of America Patent
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Mar 15, 1994
Grant Date -
N/A
app pub date -
Sep 25, 1992
filing date -
Sep 26, 1991
priority date (Note) -
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Abstract
A plurality of circuit boards are used and frames are attached to the circuit boards to surround the peripheral portions thereof. Since connection terminals electrically connected to the respective circuit boards are attached to the respective frames, a semiconductor device having semiconductor elements mounted at high density can be formed by stacking the first and second frames on each other and setting the respective connection terminals in contact with each other to electrically connect the circuit boards to each other.
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