Plastic-molded-type semiconductor device and producing method therefor
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United States of America Patent
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Mar 15, 1994
Grant Date -
N/A
app pub date -
Nov 14, 1991
filing date -
Nov 14, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.
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