Method of soldering using a special atmospheric gas
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United States of America Patent
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-
Mar 22, 1994
Grant Date -
N/A
app pub date -
Dec 10, 1992
filing date -
Dec 20, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of soldering for surface mounting of a printed circuit board, which comprises performing reflow soldering with a rosin-based cream solder in a special atmospheric gas comprising an inert gas such as N.sub.2, Ar or He and containing about 10,000 ppm or less of oxygen and 0.5-3.0% of moisture is disclosed.
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