Supportable contact and chip carrier socket for use with an assembly/disassembly tool
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United States of America Patent
Stats
-
Mar 22, 1994
Grant Date -
N/A
app pub date -
Oct 30, 1992
filing date -
Oct 30, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An improved contact for use in a high density chip carrier socket mounted on a circuit member which utilizes a cover which to wedge the leads of the chip carrier into electrical engagement with a respective contact. A tool receiving recess is incorporated into the contact so that the forces exerted on the socket while pressing the cover into place can be opposed, minimizing the forces exerted on the connection between the socket and the circuit member, typically a solder joint. Providing a tool, that operates from one side of the circuit member, in order to press the cover into place while engaging the contact recess to oppose the insertion related forces, which can also pull the cover from the contacts, without exerting significant forces on the connection, by engaging a lip in the cover while pressing on the carrier.
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