Mold for printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 22, 1994
Grant Date -
N/A
app pub date -
Mar 18, 1992
filing date -
Mar 20, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mold used in producing printed wiring board is disclosed. The mold comprises upper dies and lower dies for sandwiching a printed wiring board therebetween, thereby performing drilling, punching or the like, one of said upper dies and lower dies having a press surface which is provided with concave or convex portions for absorbing steps caused by forming a printed wiring circuit on the printed wiring board.
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Family
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Cited Art Landscape
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