Laser processing method for a thin-film structure
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United States of America Patent
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Mar 22, 1994
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app pub date -
Sep 18, 1992
filing date -
Oct 7, 1991
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Abstract
A method for eroding material, particularly material in a thin-film structure, that includes at least one thin-film arranged over at least one transparent layer, includes irradiating the thin-film with a laser pulse through the transparent layer. The laser pulse has a wavelength in the absorption region of the thin-film. The irradiated thin-film region, together with any layers lying above the thin-film region, are popped off, without any residue, from the transparent layer.
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