Electroless copper plating bath
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United States of America Patent
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-
Mar 29, 1994
Grant Date -
N/A
app pub date -
Nov 30, 1992
filing date -
Nov 28, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electroless copper plating bath comprises a water soluble copper salt, a complexing agent, and a reducing agent consisting of phosphorous acid or a phosphite. As compared with conventional acidic bath using hypophosphorous acid, the bath is less expensive while depositing a uniform copper film at equivalent efficiency.
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