US Patent No: 5,298,548

Number of patents in Portfolio can not be more than 2000

Epoxy resin composition and semiconductor devices encapsulated therewith

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Abstract

An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SHIN-ETSU CHEMICAL CO., LTD.TOKYO3509

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoki, Takayuki Toyota, JP 67 288
Shimizu, Hisashi Kusatsu, JP 56 459
Shiobara, Toshio Gunma-ken, JP 190 1007
Tomiyoshi, Kazutoshi Usui-gun, JP 51 360
Tsuchiya, Takashi Tokyo, JP 63 323

Cited Art

Patent Info (Count) # Cites Year
 
SHIN-ETSU CHEMICAL CO., LTD. (3)
4,859,722 Epoxy resin composition 28 1988
4,877,822 Epoxy resin composition 23 1988
5,190,995 Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith 6 1991
 
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (1)
4,551,508 Polyglycidyl ethers, process for production thereof, and cured products thereof 15 1984
 
NIPPON STEEL CHEMICAL CO., LTD. (1)
5,068,293 Naphthol-based epoxy resins, intermediates for the same, process for preparing the same, and epoxy resin compositions containing the same 7 1990

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
6,111,323 Reworkable thermoplastic encapsulant 23 1997
5,998,876 Reworkable thermoplastic hyper-branched encapsulant 4 1997
6,326,237 Reworkable thermoplastic hyper-branched encapsulant 1 1999
 
SHIN-ETSU CHEMICAL CO., LTD. (3)
5,418,266 Epoxy resin compositions and semiconductor devices encapsulated therewith 10 1994
5,827,908 Naphthalene and or biphenyl skeleton containing epoxy resin composition 18 1997
7,943,706 Semiconductor encapsulating epoxy resin composition and semiconductor device 0 2006
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
5,430,330 Semiconductor device, resin for sealing same and method of fabricating same 12 1993
5,539,218 Semiconductor device and resin for sealing a semiconductor device 4 1995
 
SUMITOMO BAKELITE CO., LTD. (2)
6,242,110 Epoxy resin composition and semiconductor device using the same 7 1998
6,361,879 Semiconductor device and method for fabricating it, and semiconductor sealing resin composition 5 1999
 
COOKSON SINGAPORE PTE LTD (1)
6,437,026 Hardener for epoxy molding compounds 9 2001
 
HITACHI CHEMICAL COMPANY, LTD. (1)
6,207,789 Phenolic resin, resin composition, molding material for encapsulation, and electronic component device 2 2000
 
NEC CORPORATION (1)
5,972,739 Method of manufacturing a tab semiconductor device 17 1998
 
NIPPON KAYAKU KABUSHIKI KAISHA (1)
5,780,571 Naphthalene ring-containing resins, resin compositions and cured products thereof 3 1997
 
NOVOC PERFORMANCE RESINS OF WISCONSIN, LLC (1)
5,691,402 Composite tooling material having vinyl ester resins and fillers 3 1996
 
TATSUMORI LTD. (1)
6,221,509 Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith 8 1999
 
Other [Check patent profile for assignment information] (1)
6,309,587 Composite molding tools and parts and processes of forming molding tools 2 1999