Kelvin chuck apparatus and method of manufacture
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United States of America Patent
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-
Apr 19, 1994
Grant Date -
N/A
app pub date -
Mar 25, 1993
filing date -
Mar 25, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A chuck for holding semiconductor wafers during testing of circuits formed thereon has a flat mounting surface with dual electrically isolated Kelvin contacts on the surface and passages communicating between the surface and a vacuum manifold for securing the wafers on the chuck with air pressure.
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